Anycubic i3 Mega S
TECHNICAL SPECIFICATIONS
| Print Technology | FDM (Fused Deposition Modeling) |
| Large build volume: | 210 x 210 x 205 mm |
| Positioning Accuracy: | X/Y 0.0125mm Z 0.002mm |
| Supported Print Materials: | TPU, PLA, ABS, HIPS, Wood |
| Full Rigid Solid metal frame construction and superior stability | |
| High quality, accurate printing with layer resolution down to 50 microns | |
| Ultrabase for excellent adhesion and easy parts removal | |
| Auto Resume Print from Power Outage | |
| High Quality Titan Extrusion to print Flexible filaments | |
| Suspended Spool(Filament) Holder | |
| Input Formats: | .STL, .OBJ, .DAE, .AMF |
| Ambient Operating Temperature: 8ºC - 40ºC | |
| Connectivity SD Card, USB Port (expert users only) | |
| Package Weight: | 16.5kg |

